Job Details: Job Description: The Advanced Packaging Technology Development (APTD) Substrate and Wafer Assembly organization is responsible for developing cutting edge substrate packaging and wafer assembly solutions for our customers. As a member of the Substrate
Job Summary • To process overseas and local payments and collection (OTT/ITT/STS TT/, OLT, ILT, ITT) in CMO TP systems from end to end • To be a user of CMO TP systems (DOTOPAL, EBBS,.) and
JOB SUMMARY Processing staff in Trade ops VN as per Delegated Authority under Document Trade or Open Account Financing under core TP DTP/OTP systems RESPONSIBILITIES Overall Responsibilities: • To comply with Product & Processing Operations that
JOB SUMMARY Processing staff in Trade ops VN as per Delegated Authority under Document Trade or Open Account Financing under core TP DTP/OTP systems RESPONSIBILITIES Overall Responsibilities: • To comply with Product & Processing Operations that