Refine Reset All
Xem theo
Việc làm liên quan
Duyệt theo ngày
Duyệt theo địa điểm làm việc
Thời gian
Nhà tuyển dụng
1 – 2 trong số 2
Job Details: Job Description: The Advanced Packaging Technology Development (APTD) Substrate and Wafer Assembly organization is responsible for developing cutting edge substrate packaging and wafer assembly solutions for our customers. As a member of the Substrate
Drive next-generation AI power module packaging for HPC applications, leading cutting-edge semiconductor package innovation from concept to product launch. Join us to shape advanced Back-End technologies while collaborating with global experts and customers. Your role Key
C�ng việc đề xuất cho bạn
