Job Details: Job Description: The Advanced Packaging Technology Development (APTD) Substrate and Wafer Assembly organization is responsible for developing cutting edge substrate packaging and wafer assembly solutions for our customers. As a member of the Substrate Technology Integration
Introduce and maintains assembly processes and activities to ensure the requested requirements from manufacturing and quality are achieved. Cross-functional work with NPD and other manufacturing teams to transfer, qualify and ramp-up of new product/package/technology. Giới thiệu
Drive next-generation AI power module packaging for HPC applications, leading cutting-edge semiconductor package innovation from concept to product launch. Join us to shape advanced Back-End technologies while collaborating with global experts and customers. Your role Key responsibilities in